TOPPING DX3 Pro+ ES9038Q2M Desktop DAC & Headphone Amplifier

• Four output modes: Headphone Amp, Headphone Amp+Line out, DAC, and Pre-amplifier.
• QCC5125 chipset, supports LDACIAAC/SBCIAPTXIAPTX LL/APTX HD protocol
• 2nd generation 8 core XMOS XU208, USB input supports up to PCM32bit768kHz and DSD512 native
• Optimized NFCA circuit, with ultra low noise and distortion
• 32ohm load: 1800mW x2 | 300ohm load: 250mW x2
• Two gain settings, +6dB Lo Gain | +19dB Hi Gain

Premium ESS Sabre DAC Chip:
Topping DX3 Pro+ is equipped with a high-performance ES9038Q2M DAC chip from ESS Sabre Technologies. It is implemented with careful engineering and attention achieving an ultra-low THD+N rating of 0.00015% ensuring quality performance.

High-Performance XMOS USB Processor:
Topping DX3 Pro+ features a premium XMOS XU208 USB processor that provides high-resolution PCM and DSD decoding. It supports 32-Bit/768kHz and native DSD512 decoding.

Powerful NFCA Headphone Amp Circuit:
Topping has designed a new NFCA headphone amp circuit optimized for the DX3 Pro+. It provides powerful signal amplification ultra-low noise and distortion. It supports both high-sensitivity low impedance IEMs as well as power-hungry full-size headphones. It produces a powerful output of up to 1.8W at 32Ω of load. DX3 Pro+ has two-level gain modes.

Qualcomm’s Latest Bluetooth Chip:
Topping DX3 Pro+ adopts Qualcomm’s latest QCC5125 Bluetooth chipset that provides high-res Bluetooth connection with LDAC, APTX HD, APTX LL, AptX, SBC, and AAC codecs. To ensure quality performance the internal DAC of QCC5125 is avoided, the signal reaches ES9038Q2M for decoding.

Difference Between DX3 Pro and DX3 Pro+:
Topping has upgraded the highly-acclaimed DX3 Pro with better audio components that make the DX3 Pro+. It uses an upgraded QCC5125 Bluetooth chip, achieves up to 60% lower distortion ratings, doubles the power, and also has better output impedance. It is overall a much better device compared to the last-gen DX3 Pro.